J. Hommel et al., NEARLY DAMAGE-FREE DRY-ETCHING OF ALGAINP GAINP BY ELECTRON-CYCLOTRON-RESONANCE TECHNIQUE/, Microelectronic engineering, 23(1-4), 1994, pp. 349-352
A nearly damage-free dry etching process in the material system AlGaIn
P/GaInP is demonstrated. An electron cyclotron resonance (ECR) ion sou
rce has been used for plasma excitation. Photoluminescence spectroscop
y at varying excitation power densities and sample temperatures is use
d to measure the degree of damage.