The simulation tool presented in this paper is used for resist exposur
e and development in electron beam lithography. The novel feature is t
hat first, the electron distribution function is evaluated from the Bo
ltzmann transport equation which is solved with suitable boundary cond
itions. Then, the energy deposition function (EDF) necessary in the ex
posure and development stages, follows. The program has been tested in
the case of resist layers on a multi-component substrate for electron
beams in the range 10-50KeV and it has been proved much faster than t
he Monte-Carlo approach.