Wk. Chim et Ky. Chong, BUILDING IN RELIABILITY FOR SILVER DIE ATTACHED LIGHT-EMITTING-DIODES, Microelectronics and reliability, 34(3), 1994, pp. 495-507
In this paper, we present a failure analysis and reliability case hist
ory of light emitting diodes (LEDs), used in a fibre optics transmitte
r product, bonded using silver die attach epoxy. The observed failure
mode was a reduction in light output of the transmitter device due to
increased forward voltage after pulsed, high current operation which w
as attributed to the electrical degradation of the silver die attach e
poxy. Steps taken to design in reliability into the product involved e
xperimental design to optimize the die attach process, evaluation of m
ore robust epoxies which can withstand accelerated high temperature an
d high current burn-in conditions, and the use of an improved die back
-contact metallization system. Reliability performance of the die atta
ch system was predicted and extrapolated to actual field application a
nd burn-in conditions.