LOW-TEMPERATURE GAAS EPITAXIAL-GROWTH ON SI(100) BY MOLECULAR-BEAM EPITAXY AND THE POSTGROWTH RAPID THERMAL ANNEALING

Citation
Ty. Chiang et al., LOW-TEMPERATURE GAAS EPITAXIAL-GROWTH ON SI(100) BY MOLECULAR-BEAM EPITAXY AND THE POSTGROWTH RAPID THERMAL ANNEALING, Journal of crystal growth, 135(3-4), 1994, pp. 469-475
Citations number
21
Categorie Soggetti
Crystallography
Journal title
ISSN journal
00220248
Volume
135
Issue
3-4
Year of publication
1994
Pages
469 - 475
Database
ISI
SICI code
0022-0248(1994)135:3-4<469:LGEOSB>2.0.ZU;2-C
Abstract
This article presents low temperature GaAs epitaxial growth on Si(100) by molecular beam epitaxy and the improvement of epitaxial quality by post-growth rapid thermal annealing. The silicon wafer was ex-situ cl eaned by spin-etch method to obtain a hydrogen-passivated surface befo re wafer loading. An in-situ cleaning process for hydrogen removal was carried out in the growth chamber by heating the silicon substrate to a low pre-growth desorption temperature (250-600-degrees-C) prior to epitaxial growth. Epitaxial films were grown at 250-580-degrees-C with strained layer superlattice to reduce defect density. The epitaxial f ilms were characterized by cross-sectional transmission electron micro scopy, scanning electron microscopy, photoluminescence, and double cry stal X-ray diffraction. The GaAs epitaxial quality improves with pre-g rowth desorption temperature and deposition temperature. The epitaxial films were treated by rapid thermal annealing to improve epitaxial qu ality. Optimum annealing conditions of epitaxial films grown at differ ent temperature were also investigated.