INTERACTIVE THERMAL MODELING OF ELECTRONIC-CIRCUIT BOARDS

The numerical modeling of printed circuit board (PCB) configurations i s becoming more prevalent as denser electronic packages are manufactur ed. Determining an optimal PCB design typically requires modeling and testing several different chip conifigurations. At present, much of th e time and cost spent modeling these various configuration is repetiti ve in nature, with the same chip or board being regenerated several ti mes before obtaining the most efficient design. By using a decoupled, iterative, numerical technique, a more systematic and efficient method for determining PCB temperature distributions has been developed and incorporated into a controlling algorithm which utilizes any standard finite element code. Steady-state temperature distributions are obtain ed for each decoupled chip/board component by iterating upon decoupled interface boundary conditions until convergence is obtained. The main advantages of this decoupling technique are the elimination of repeti tive numerical-model generation and the high level of interactive desi gn provided.