G. Bruno et al., STUDY OF THE NF3 PLASMA CLEANING OF REACTORS FOR AMORPHOUS-SILICON DEPOSITION, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 12(3), 1994, pp. 690-698
Citations number
19
Categorie Soggetti
Physics, Applied","Materials Science, Coatings & Films
NF3 plasmas have been investigated for the cleaning of reactors for am
orphous silicon (a-Si:H) deposition from silane. Optical emission spec
troscopy, also time resolved, has been used to measure F, N2*, NF*, a
nd SiF emitting species in the plasma phase. Measurements of mass spe
ctrometry, etching rate and dc self-bias voltage at the rf powered ele
ctrode have also been used for process diagnostics, The a-Si:H etching
process by F atoms is shown to occur under loading conditions: the et
ching rate does not correlate with F atom density. The recombination p
rocesses NF(x)+F-->NF(x+1) (x=2,1) and NF+NF-->N2+2F together with the
NF3 electron impact dissociation into NF(x)+F have been found to be s
ignificant for the NF3 plasma chemistry as well as the fluorine conver
sion into SiF4.