ADHESION BETWEEN POLYCARBONATE SUBSTRATE AND SIO2 FILM FORMED FROM SILANE AND NITROUS-OXIDE BY PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION

We studied the adhesion of a silicon dioxide film, formed from silane and nitrous oxide gas by plasma-enhanced chemical vapor deposition, to a polycarbonate substrate and die bonding between the film and the su bstrate by x-ray photoelectron spectroscopy. Adhesion of the SiO2 film to the polycarbonate increases with increasing SiH4 flow rate. All Si O2 film squares produced at a SiH4 flow rate of 10 standard cm3 min-1 exhibited good adhesion to the substrate. An analysis of the x-ray pho toelectron spectra indicates that more phenyl groups are decomposed as adhesion increases. The bonding between the SiO2 film and the polycar bonate substrate is discussed on the basis of x-ray photoelectron spec troscopy. The Si-O-C bonding between SiO2 and polycarbonate results in good adhesion between the film and the substrate.