Jc. Zolper et al., AN ALL-IMPLANTED, SELF-ALIGNED, GAAS JFET WITH A NONALLOYED W P+-GAASOHMIC GATE CONTACT/, I.E.E.E. transactions on electron devices, 41(7), 1994, pp. 1078-1082
We describe a self-aligned, refractory metal gate contact, enhancement
mode, GaAs junction field effect transistor (JFET) where all impurity
doping was done by ion implantation. Processing conditions are presen
ted for realizing a high gate turn-on voltage (approximately 1.0 V at
1 mA/mm of gate current) relative to GaAs MESFET's. The high gate turn
-on voltage is the result of optimizing the p+-gate implant and anneal
to achieve a nonalloyed ohmic contact between the implanted p+-GaAs a
nd the sputter deposited tungsten gate contact. Initial nominally 1.0
mum x 50 mum n-JFET's have a transconductance of 85 mS/mm and f(t) of
11.4 GHz.