S. Logothetidis et A. Barborica, IN-SITU AND REAL-TIME ROOM-TEMPERATURE OXIDATION STUDIES OF FCC TIN THIN-FILMS, Microelectronic engineering, 33(1-4), 1997, pp. 309-316
In-situ and real time ellipsometry was used to study the oxidation pro
cess of thin fee TINx films. The films were grown by DC reactive magne
tron sputtering at various negative bias voltages (V-b) in order to de
posit TiNx with different stoichiometries and then exposed to several
gases and to air at room temperature. The oxidation rate was found to
depend strongly on the V-b. High oxidation is observed at low V-b, whe
re the nitrogen is weakly bonded to Ti and thus more easily can be rep
laced. By analysing the spectroscopic ellipsometry (SE) data, it was f
ound that oxidation takes place in the bulk of the film and can procee
d up to a 10% transformation of titanium nitride into oxide. From the
SE results and those obtained from stress measurements during exposure
to air, it is concluded that the fastest and most important mechanism
for the film oxidation is through grain boundary diffusion and reacti
on of oxygen with the weakly bonded Ti-N.