THE TRADEOFF BETWEEN PERIPHERAL AND AREA ARRAY BONDING OF COMPONENTS IN MULTICHIP MODULES

This paper examines the tradeoff between peripheral I/O format die (fo r wirebonding, tape automated bonding (TAB), or peripheral flip chip b onding) and area array I/O format die (for flip chip bonding), as a fu nction of partitioning a fixed functionality into a variable number of die. The comparison in this study has been made in the context of a m ultichip module (MCM). The analysis approach used concurrently conside rs module size, thermal and electrical performance, and cost (includin g module-level test and rework) to assess the overall applicability of one bonding format over the other.