Sl. Zhang et al., ON CONTACT RESISTANCE MEASUREMENT USING 4-TERMINAL KELVIN STRUCTURES IN ADVANCED DOUBLE-POLYSILICON BIPOLAR-TRANSISTOR PROCESSES, I.E.E.E. transactions on electron devices, 41(8), 1994, pp. 1414-1420
The contact between a polycrystalline silicon (polysilicon) layer and
a silicon substrate is investigated for an advanced double-polysilicon
bipolar transistor process. Contact resistances are measured using fo
ur-terminal cross bridge Kelvin structures. The specific contact resis
tivity of the interface and the sheet resistance of the doped substrat
e region directly underneath the contact are extracted using a two-dim
ensional simulation model originally developed for metal-semiconductor
contacts. The extracted sheet resistance values are found to be large
r than those measured using van der Pauw structures combined with anod
ic oxidation and oxide removal. During the fabrication of the contacts
, epitaxial realignment of the polysilicon in accordance to the substr
ate orientation and severe interdiffusion of dopants across the interf
ace take place, which complicate the characterization. The validity of
the two-dimensional simulation model applied to the poly-mono silicon
contact is discussed.