Mb. Brooks et Tw. Sigmon, A COMPARATIVE-STUDY OF N+ OHMIC CONTACT RESISTANCE FOR PDINGE AND NIGEAU METALLIZATIONS ON GAAS, I.E.E.E. transactions on electron devices, 41(8), 1994, pp. 1469-1471
NiGeAu and PdInGe metallizations are used for n+ ohmic contacts to GaA
s. One-dimensional analytic and two-dimensional numerical analyses are
presented using experimental data obtained from transmission line and
cross bridge Kelvin test structures. Results from the 1-D and 2-D mod
els show that the former analysis overestimates the specific contact r
esistance by at least an order of magnitude. This discrepancY is shown
to be test structure dependent and metallization independent.