K. Tsujimoto et al., SHORT-GAS-RESIDENCE-TIME ELECTRON-CYCLOTRON-RESONANCE PLASMA-ETCHING, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 12(4), 1994, pp. 1209-1215
Citations number
25
Categorie Soggetti
Physics, Applied","Materials Science, Coatings & Films
This paper describes short-gas-residence-time electron cyclotron reson
ance plasma etching for high etch rates, reduced contamination, and hi
ghly anisotropic etching. The new high-gas-flow-rate (high-flow) etchi
ng system is demonstrated with effective-pumping rate of 2500 l/s. Thi
s method produces very high etch rate while maintaining high anisotrop
y at very low gas pressure below 1 mTorr. The high etch rate is due to
the reduction of reaction products density because of the very short
gas-residence time of 30 ms. This technique also dramatically reduces
the contamination of reaction products. Etching of crystalline Si and
n+ polycrystalline Si with the high-flow etching system is demonstrate
d. For crystalline Si etching with Cl2, a high etch rate up to 1/mum/m
in is achieved at a high gas flow rate of 90 sccm at 0.5 mTorr.