CARBON DOPING AND ETCHING EFFECTS OF CBR4 DURING METALORGANIC CHEMICAL-VAPOR-DEPOSITION OF GAAS AND ALAS

Citation
K. Tateno et al., CARBON DOPING AND ETCHING EFFECTS OF CBR4 DURING METALORGANIC CHEMICAL-VAPOR-DEPOSITION OF GAAS AND ALAS, Journal of crystal growth, 172(1-2), 1997, pp. 5-12
Citations number
26
Categorie Soggetti
Crystallography
Journal title
ISSN journal
00220248
Volume
172
Issue
1-2
Year of publication
1997
Pages
5 - 12
Database
ISI
SICI code
0022-0248(1997)172:1-2<5:CDAEEO>2.0.ZU;2-K
Abstract
We have investigated carbon (C) doping and the reduction in the growth rate for GaAs and AlAs using CBr4 by metalorganic chemical vapor depo sition (MOCVD). The C concentration is proportional to [CBr4], [AsH3]( -1) and exp(-E(a)/RT) (E(a)=-1.4 eV in GaAs and -1.3 eV in AlAs). Thes e activation energies (E(a)) are equal to the Gibbs free energy of CBr 4 (1.3 eV) around the growth temperature. This indicates that the C in corporation is determined by the equilibrium of the vapor CBr3, which is easily decomposed from CBr4 in the gas phase. The C concentration o f AlAs is about one order of magnitude higher than that of GaAs. The a ctivity of C as an acceptor is close to 100% in GaAs and 80% in AlAs, and slightly depends on the growth temperature (T-g) and the V/III rat io. The reduction in the growth rate (gamma) for GaAs is proportional to [CBr4], [AsH3](-0.5) and exp(-E(a)/RT) (E(a)=1.2 eV), while for AlA s it is proportional to [CBr4], [AsH3](-1.0) and exp(-E(a)/RT) (E(a)=- 1.5 eV). These findings suggest that there are different types of etch ing mechanisms: for GaAs, the etching may be limited by the As removal , which is followed by fast Ga removal by HBr from CBr4 decomposition. On the other hand, for AlAs, the etching may be performed by adsorbed CBrx (x=1-3) during the doping process. The hole concentration (p) of AlGaAs is equal to the average of those of GaAs and AlAs. However, ga mma for AlGaAs is not a simple average of those for GaAs and AlAs. Thi s suggests that there is some alloy effect in addition to the above tw o etching processes.