A new method is developed for n-type, high-resistivity (up to 150 Omeg
a . cm), targe-diameter (up to 125 mm), low-cost silicon crystals for
power devices such as diodes, thyristors and transistors. The required
resistivity of silicon is achieved during both crystal growth and pow
er device manufacturing processes. The main properties of UDCz silicon
and some parameters of the transistors made from this silicon are pre
sented.