Th. Wang et al., EFFECTS OF HOT-CARRIER-INDUCED INTERFACE STATE GENERATION IN SUBMICRON LDD MOSFETS, I.E.E.E. transactions on electron devices, 41(9), 1994, pp. 1618-1622
A two-dimensional numerical simulation including a new interface state
generation model has been developed to study the performance variatio
n of a LDD MOSFET after a dc voltage stress. The spatial distribution
of hot carrier induced interface states is calculated with a breaking
silicon-hydrogen bond model. Mobility degradation and reduction of con
duction charge due to interface traps are considered. A 0.6 mum LDD MO
SFET was fabricated. The drain current degradation and the substrate c
urrent variation after a stress were characterized to compare the simu
lation. A reduction of the substrate current at V(g) congruent-to 0.5
V(d) in a stressed device was observed from both the measurement and t
he simulation. Our study reveals that the reduction is attributed to a
distance between a maximum channel electric field and generated inter
face states.