A rapid thermal chemical vapour deposition system has been employed fo
r the deposition of SiC layers in the temperature range 1000-1040-degr
ees-C. Layers have been shown to be polycrystalline beta-SiC strongly
aligned to the silicon substrate. Carbon content has been controlled o
ver the range 6-50% and U.V. spectroscopy has related carbon content t
o cut off wavelength. Oxygen content in layers has been minimised and
shown to be related to carbon concentration. Growth has occurred initi
ally at localised preferred sites and time periods in excess of 60 sec
onds have been shown necessary at 1040-degrees-C to achieve growth of
SiC over the entire surface area.