Ai. Usoskin et al., DOUBLE-STEP INTEGRATED DEPOSITION PROCESS FOR MULTILAYERS WITH ACCURATE PERIODICITY, Microelectronic engineering, 25(2-4), 1994, pp. 299-304
A new method for vacuum deposition of multilayers with accurate period
icity, based on a double-step transfer of the starting materials from
molecular sources to the substrate is described. The main advantage of
such a method seems to be a possibility to shorten and to simplify si
gnificantly the deposition process.