DOUBLE-STEP INTEGRATED DEPOSITION PROCESS FOR MULTILAYERS WITH ACCURATE PERIODICITY

Authors
USOSKIN AI FREYHARDT HC SEMINOZHENKO VP POPOVA OA
Citation
Ai. Usoskin et al., DOUBLE-STEP INTEGRATED DEPOSITION PROCESS FOR MULTILAYERS WITH ACCURATE PERIODICITY, Microelectronic engineering, 25(2-4), 1994, pp. 299-304
Citations number
NO
Categorie Soggetti
Optics,"Physics, Applied","Engineering, Eletrical & Electronic
Journal title
Microelectronic engineering → ACNP
ISSN journal
01679317
Volume
25
Issue
2-4
Year of publication
1994
Pages
299 - 304
Database
ISI
SICI code
0167-9317(1994)25:2-4<299:DIDPFM>2.0.ZU;2-S
Abstract
A new method for vacuum deposition of multilayers with accurate period icity, based on a double-step transfer of the starting materials from molecular sources to the substrate is described. The main advantage of such a method seems to be a possibility to shorten and to simplify si gnificantly the deposition process.