Ah. Rawicz, STRESS-INDUCED CORROSION OF WIRE MICRO-JOINTS IN MICROELECTRONICS - AQUANTITATIVE MODEL, Microelectronics and reliability, 34(5), 1994, pp. 875-882
The analytical correlation between electrochemical corrosion susceptib
ility and stress residue caused by ultrasonic or other welding techniq
ues for wire micro-joints has been derived. The correlation is based o
n a physical-chemical model of changes in the electrochemical potentia
ls of crystallographic structure induced by microdefects in the most d
eformed parts of the wire. The experimental confirmation of the correl
ation was performed on single crystals and polycrystalline samples of
Ni, as well as on 25um Aluminum wire joints. The agreement is signific
ant. The unreliability of a wire joint is considered to be a strong fu
nction of the corrosion susceptibility in the joint.