MICROLENS LITHOGRAPHY AND SMART MASKS

We report on recent progress in the implementation of microlens lithog raphy. In addition, we will introduce a new lithographic method, smart mask lithography. Microlens lithography is aimed at the fabrication o f flat panel displays (FPD), multichip modules (MCM) and micromachinin g. An array of micro-objectives is used to image a photomask onto a re sist layer. Microlens lithography provides a resolution of 3 to 5 mu m , a depth of focus of 50 to 100 mu m, and a working distance of 1 to 3 mm. Smart mask lithography is aimed at the printing of simple mask pa tterns, such as a matrix of posts or holes, as required for field emis sion displays (FEDs), or other patterns consisting of dots, lines, cir cles, or rectangles, as required for MCMs and printed circuit boards). Smart mask lithography covers the range of 1 to 100 mu m feature size s. We will present experimental results and discuss advantage and prob lems of both methods.