DESIGNING AND BUILDING-IN RELIABILITY IN ADVANCED MICROELECTRONIC ASSEMBLIES AND STRUCTURES

New technologies in electronics require that product development embra ce the paradigms of design for reliability and built-in reliability, T hese paradigms require effective measures to create robust designs and manufacturing processes, This objective must be achieved through mode ling failure processes and taking proactive steps early in the develop ment, Following an assessment of material properties, finite element m odels are built of key structures in the system, A statistical experim ental design is then developed, This statistically designed ''virtual experiment'' will include the geometrical and materials' variables com prising the system and a damage model, such as a fatigue prediction mo del, Information for process development or improvement is derived fro m the virtual experiment, The statistical model is then embedded in a Monte Carlo simulation to assess the impact of uncertainty and variabi lity, This process of stochastic physics of failure is the subject of this paper, The process will be described and an application of this s ystems engineering based approach to micro-via interconnect reliabilit y, in a complex multichip module (MCM), will be presented.