MECHANICAL-THERMAL NOISE IN MICROMACHINED ACOUSTIC AND VIBRATION SENSORS

Authors
Citation
Tb. Gabrielson, MECHANICAL-THERMAL NOISE IN MICROMACHINED ACOUSTIC AND VIBRATION SENSORS, I.E.E.E. transactions on electron devices, 40(5), 1993, pp. 903-909
Citations number
32
ISSN journal
00189383
Volume
40
Issue
5
Year of publication
1993
Pages
903 - 909
Database
ISI
SICI code
0018-9383(1993)40:5<903:MNIMAA>2.0.ZU;2-Q
Abstract
Since the introduction of the micromachining process, wherein mechanic al structures are etched from blocks of silicon, a number of very smal l acoustic and vibration sensors have been built. This size reduction is attractive for many applications but the small moving parts are esp ecially susceptible to mechanical noise resulting from molecular agita tion. For sensors designed for small-signal applications (microphones and hydrophones, for example), this mechanical-thermal noise is often one of the limiting noise components. While this component is often ne glected in design and analysis, it is relatively easy to estimate, sin ce, like electrical-thermal noise, the magnitude of mechanical-thermal noise depends only on temperature and the magnitude of mechanical dam ping. This paper reviews several techniques for calculating the mechan ical-thermal noise in acoustic and vibration sensors in general and in micro-machined sensors in particular.