Tb. Gabrielson, MECHANICAL-THERMAL NOISE IN MICROMACHINED ACOUSTIC AND VIBRATION SENSORS, I.E.E.E. transactions on electron devices, 40(5), 1993, pp. 903-909
Since the introduction of the micromachining process, wherein mechanic
al structures are etched from blocks of silicon, a number of very smal
l acoustic and vibration sensors have been built. This size reduction
is attractive for many applications but the small moving parts are esp
ecially susceptible to mechanical noise resulting from molecular agita
tion. For sensors designed for small-signal applications (microphones
and hydrophones, for example), this mechanical-thermal noise is often
one of the limiting noise components. While this component is often ne
glected in design and analysis, it is relatively easy to estimate, sin
ce, like electrical-thermal noise, the magnitude of mechanical-thermal
noise depends only on temperature and the magnitude of mechanical dam
ping. This paper reviews several techniques for calculating the mechan
ical-thermal noise in acoustic and vibration sensors in general and in
micro-machined sensors in particular.