Doping profiles and electrical properties are investigated on SiC samp
les doped with single energy implants from nitrogen. The profiles are
analysed using Pearson distributions for different implantation energi
es and temperatures. Implantations are performed for temperatures up t
o 1200 degrees C. Diffusion during high temperature implantation is in
vestigated and the diffusion coefficients measured range from 1.09 x 1
0(-15) to 1.53 x 10(-14)cm(2)/s depending on temperature. The activati
on energy for implantation enhanced diffusion is estimated to be 0.91
eV. A comparison is made with diffusion during annealing. The activate
d dopants from high temperature implantation are investigated by the H
all probe method, showing that activation and mobility increase with t
emperature.