E. Gogolides et al., CHARACTERIZATION OF A POSITIVE-TONE WET SILYLATION PROCESS WITH THE AZ 5214TM PHOTORESIST, Microelectronic engineering, 21(1-4), 1993, pp. 263-266
A liquid phase (wet) silylation process has been developed1 using the
commercial photoresist AZ 5214TM, and I-line lithography. Here, the pr
ocess is characterized using proton NMR (Nuclear Magnetic Resonance) s
pectroscopy, and SEM analysis of fabricated submicron patterns.