TRANSMISSION ELECTRON-MICROSCOPY OF ELECTRODEPOSITS

Authors
GIANNUZZI LA HOWELL PR PICKERING HW BITLER WR
Citation
La. Giannuzzi et al., TRANSMISSION ELECTRON-MICROSCOPY OF ELECTRODEPOSITS, Journal of electronic materials, 22(6), 1993, pp. 639-644
Citations number
24
Categorie Soggetti
Engineering, Eletrical & Electronic","Material Science
Journal title
Journal of electronic materials → ACNP
ISSN journal
03615235
Volume
22
Issue
6
Year of publication
1993
Pages
639 - 644
Database
ISI
SICI code
0361-5235(1993)22:6<639:TEOE>2.0.ZU;2-H
Abstract
Commercial electrodeposits are usually fine grained and highly stresse d. Conventional transmission electron microscopy (TEM) studies reveal defect-free structures except for the presence of twins. However, high voltage TEM studies of thick specimens show a high concentration of d islocations and lack of twins, which suggests a restructuring of elect rodeposits during TEM specimen thinning.