3-DIMENSIONAL FINITE-ELEMENT INVESTIGATION OF CURRENT CROWDING AND PEAK TEMPERATURES IN VLSI MULTILEVEL INTERCONNECTIONS

Authors
TRATTLES JT ONEILL AG MECROW BC
Citation
Jt. Trattles et al., 3-DIMENSIONAL FINITE-ELEMENT INVESTIGATION OF CURRENT CROWDING AND PEAK TEMPERATURES IN VLSI MULTILEVEL INTERCONNECTIONS, I.E.E.E. transactions on electron devices, 40(7), 1993, pp. 1344-1347
Citations number
10
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied
Journal title
I.E.E.E. transactions on electron devices → ACNP
ISSN journal
00189383
Volume
40
Issue
7
Year of publication
1993
Pages
1344 - 1347
Database
ISI
SICI code
0018-9383(1993)40:7<1344:3FIOCC>2.0.ZU;2-1
Abstract
Multilevel interconnection vias are investigated with a coupled therma l and electrical conduction model in three dimensions using the finite -element method. The concept of using a volume to quanitfy current cro wding is introduced. Close to a contact via it is found that the peak temperature moves between the upper track and the via as a function of geometry.