M. Azimi et Rc. Jaeger, A MICROELECTRONIC TEST STRUCTURE AND NUMERICAL ALGORITHM FOR CHARACTERIZATION OF LIQUID IMMERSION HEAT-TRANSFER, IEEE transactions on components, hybrids, and manufacturing technology, 16(3), 1993, pp. 253-265
Citations number
25
Categorie Soggetti
Material Science","Engineering, Eletrical & Electronic
The design, development, and fabrication of a test section for gatheri
ng heat transfer data necessary for the efficient design of liquid imm
ersion cooling systems for microelectronic applications is presented.
The test section is a wafer scale integrated circuit design which can
be mass produced and matches the actual integrated circuits and their
geometric and material characteristics. The test section is for use in
conjunction with the other experimental apparatus to collect heat tra
nsfer data for microelectronic surfaces cooled with liquid coolants. A
numerical method for extracting the local heat transfer coefficients
from experimental immersion cooling data obtained from the test sectio
n is developed. The algorithm removes the effects of thermal spreading
, temperature averaging, and conduction temperature drop in the experi
mental test section. A numerical verification of the analytical method
is presented, and experimental results are used to confirm the validi
ty of the numerical algorithm. The algorithm demonstrates the independ
ence of the extracted heat transfer behavior from the size of the test
section heater.