The effect of metal contamination and silicon surface defects on the g
ate oxide yield is investigated. The characteristics of various cleani
ng procedures are studied and correlated with the integrity of thin ga
te oxides. The standard wet cleaning recipe is optimized and a new cle
aning strategy is proposed. Selective contamination experiments in che
micals are used to investigate the effect of small amounts of metal co
ntaminants on the gate oxide integrity. HF-last processes are investig
ated and a new wet cleaning strategy is proposed.