The ferroelectric memory is the most suitable device for memory embedd
ed applications. Its manufacturing process makes it more compatible wi
th the standard CMOS process than the traditional non-volatile memory
processes, due to device operation voltage requirements. In addition,
it provides clear advantages such as non-volatility, lower power consu
mption, higher endurance on writing cycles and higher writing speed. T
he most significant benefits of the embedded ferroelectric memory are
shown on contactless smart IC cards and RF-ID cards without battery ba
ckup, which will expand the electronic ID market in a variety of appli
cations. A super high integration chip will not be produced without ha
ving any redundancy circuit on it. If the ferroelectric memory technol
ogy is applied to FPGA (field programmable gate array), however, this
problem will be solved. The ferroelectric memory technology will lead
to a new semiconductor device architecture, and will take the major pl
ace in the coming multi-media era.