A one-mask-patterned ferroelectric capacitor memory cell structures de
signed with a 0.5-mu m feature size were fabricated. Oxygen plasma tre
atment after dry etching decreased the leakage current to as low as as
-deposited film. The one-mask-patterned ferroelectric capacitors with
switching charge almost equal to as-deposited film were achieved. Ferr
oelectric memories as dense as dynamic random access memories will bec
ome possible with this technology.