A LOW-COST MANUFACTURING PROCESS FOR HIGH-DENSITY HYBRID COMPONENTS BASED ON MULTILAYER POLYIMIDE CERAMIC STRUCTURES

Citation
M. Tudanca et al., A LOW-COST MANUFACTURING PROCESS FOR HIGH-DENSITY HYBRID COMPONENTS BASED ON MULTILAYER POLYIMIDE CERAMIC STRUCTURES, IEEE transactions on components, hybrids, and manufacturing technology, 16(1), 1993, pp. 13-20
Citations number
17
Categorie Soggetti
Material Science","Engineering, Eletrical & Electronic
ISSN journal
01486411
Volume
16
Issue
1
Year of publication
1993
Pages
13 - 20
Database
ISI
SICI code
0148-6411(1993)16:1<13:ALMPFH>2.0.ZU;2-A
Abstract
This paper describes a multichip module components manufacturing proce ss combining multilayer polyimide and multilayer low temperature cofir ed ceramic structures, using the latter as the encapsulation support. A first characterization of the results is also reported.