M. Tudanca et al., A LOW-COST MANUFACTURING PROCESS FOR HIGH-DENSITY HYBRID COMPONENTS BASED ON MULTILAYER POLYIMIDE CERAMIC STRUCTURES, IEEE transactions on components, hybrids, and manufacturing technology, 16(1), 1993, pp. 13-20
Citations number
17
Categorie Soggetti
Material Science","Engineering, Eletrical & Electronic
This paper describes a multichip module components manufacturing proce
ss combining multilayer polyimide and multilayer low temperature cofir
ed ceramic structures, using the latter as the encapsulation support.
A first characterization of the results is also reported.