N. Revil et al., A COMPARISON OF MOSFETS AGING UNDER DC,AC AND ALTERNATING STRESS CONDITIONS, Microelectronics and reliability, 33(11-12), 1993, pp. 1909-1919
The effects of static, alternating and dynamic stress conditions on th
e degradation rate of 0.8mum n- and p-channel LDD MOS transistors have
systematically been investigated and compared. The shifts of the thre
shold voltage, transconductance, linear drain current and charge pumpi
ng current were used to monitor the transistor degradation. The result
s suggest that the aging induced by a dynamic stress cannot be directl
y explained with static stress models, essentially because it is highl
y dependent on a larger number of parameters (biases and durations of
the top and bottom levels of the pulses, transient times). The correla
tion of static and dynamic stresses also clarifies the degradation mec
hanisms, in particular the role of hot holes in the generation of inte
rface states.