TAKING THERMAL CONSIDERATIONS INTO ACCOUNT DURING HIGH-LEVEL SYNTHESIS

Authors
Citation
Jp. Weng et Ac. Parker, TAKING THERMAL CONSIDERATIONS INTO ACCOUNT DURING HIGH-LEVEL SYNTHESIS, VLSI design, 5(2), 1997, pp. 183-193
Citations number
10
Categorie Soggetti
System Science","Engineering, Eletrical & Electronic","Computer Science Hardware & Architecture
Journal title
ISSN journal
1065514X
Volume
5
Issue
2
Year of publication
1997
Pages
183 - 193
Database
ISI
SICI code
1065-514X(1997)5:2<183:TTCIAD>2.0.ZU;2-P
Abstract
Submicron feature sizes result in designs in which power density is si gnificantly increased. High-level synthesis strategies are proposed in this paper to relieve potential thermal problems. Operators are place d as close as possible to their data predecessors in order to minimize the interconnection cost while not violating the thermal constraints. Spreading overused functional units away from the thermal problem are a often results in performance degradation. Introducing redundant oper ators is suggested to reduce the module utilization and hence thermal problems among problem modules when system performance is important. O ur experimental results show that this technique produces quite satisf actory results for a power-dominated example.