W. Deceuninck et al., DESIGN OF A NEW TEST STRUCTURE FOR THE STUDY OF ELECTROMIGRATION WITHEARLY RESISTANCE CHANGE MEASUREMENTS, Microelectronics and reliability, 37(12), 1997, pp. 1813-1816
A new test structure has been designed in order to perform accurate ea
rly resistance change measurements in metal lines submitted to high cu
rrent stress. This test structure integrates both advantages of the so
-called ''absolute'' and ''bridge'' techniques, resulting in accurate
resistance measurements with a high resolution for both the current-st
ressed and reference strip. Due to the improved measurement configurat
ion, the aging kinetics of a metal line under current stress can be st
udied in more detail. (C) 1997 Elsevier Science Ltd.