Hh. Kim et al., ELECTRICAL-PROPERTIES OF PARAELECTRIC PLT-(28) THIN-FILMS DEPOSITED BY DC MAGNETRON SPUTTERING, Integrated ferroelectrics, 12(2-4), 1996, pp. 241-249
Paraelectric [Pb, La]TiO3 (PLT, La = 28 mol%) thin films were prepared
by de magnetron sputtering using a multi-element metal target. In ord
er to crystallize the as-deposited PLT thin films into the cubic perov
skite structure, a heat treatment was applied at annealing temperature
s ranging between 450 and 750 degrees C. The electrical measurements s
uch as dielectric proper ties, polarization-electric field (P-E), and
current-voltage (I-V) were investigated with the change of annealing t
emperature. The dielectric constant and dissipation factor of paraelec
tric PLT film annealed at 750 degrees C were 1216 and 0.018, respectiv
ely. The charge storage density was approximately 12.5 mu/cm(2). The l
eakage current density in PLT film annealed at 650 degrees C was aroun
d 0.1 mu A/cm(2) at the electric field of 0.25 MV/cm.