F. Pires et al., INTEGRATION EVALUATION OF LOW PERMITTIVITY SILICON-BASED SPIN ON MATERIALS AS IMD, Microelectronic engineering, 37-8(1-4), 1997, pp. 277-284
The integration capability of non-etchback Silicon Based Spin on Mater
ials has been studied. The via degradation due to the resist stripping
was particularly evaluated. The metal barrier adhesion and the dielec
tric constant evolution after the chemical treatment and annealing wer
e also evaluated. Some solutions to integrate these materials were pro
posed.