REACTION OF THIN NI FILMS WITH (001) 3C-SIC AT 700-DEGREES-C

Citation
Sm. Gasser et al., REACTION OF THIN NI FILMS WITH (001) 3C-SIC AT 700-DEGREES-C, Microelectronic engineering, 37-8(1-4), 1997, pp. 529-534
Citations number
5
Journal title
ISSN journal
01679317
Volume
37-8
Issue
1-4
Year of publication
1997
Pages
529 - 534
Database
ISI
SICI code
0167-9317(1997)37-8:1-4<529:ROTNFW>2.0.ZU;2-U
Abstract
The reaction layer of a thermally reacted thin Ni film, deposited by e lectron-beam evaporation on a single crystalline (001) 3C-SiC substrat e, was investigated after vacuum annealing at 700 degrees C in terms o f its morphology and structure by cross-sectional transmission electro n microscopy (TEM). Ni2Si and carbon are identified as reaction produc ts. Distinctive dissimilarities with depth in the morphology of the re acted layer are observed. Carbon appears to form isolated clusters in the upper part of the Ni2Si layer and microcolumns in the lower part.