STUDY OF DELAMINATED PLASTIC PACKAGES BY HIGH-TEMPERATURE MOIRE AND FINITE-ELEMENT METHOD

In the current study, 1200 l/mm gratings are replicated at elevated te mperatures onto the cross sections of two delaminated plastic packages : a thin quad flatpack plastic package (TQFPP) and a power small outli ne plastic package (PSOPP). The specimens are measured at room tempera ture for thermal deformation induced by cooling process, The finite el ement models are used to simulate the cooling process and the results are compared with the moire interferometry results, The finite element models with different delaminations between die and die attach are us ed to simulate the fringe patterns obtained from moire interferometry. It was found that the delamination size can be estimated by the combi nation of moire technique and finite element method. The finite elemen t model, once verified, can then be used in making cost-effective deci sions in plastic packaging design and processing.