Pg. Tucker, CFD APPLIED TO ELECTRONIC SYSTEMS - A REVIEW, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(4), 1997, pp. 518-529
The application of commercial and noncommercial computational fluid dy
namics (CFD) programs to systems relevant to electronics is reviewed,
The following commercial programs are discussed: THEBES, FLOTHERM, FLU
ENT, FLOTRAN, FIDAP/ICEPAK, CFX 4 (formerly CFDS-FLOW3D), PHOENICS/HOT
BOX, and STAR-CD. Notably, of the noncommercial programs, work utilizi
ng a spectral element program originating from the Massachusetts Insti
tute of Technology (MIT) is described, General thermofluid capabilitie
s, user friendliness, and other peripheral aspects, such as the modeli
ng of thermal stress/strain and dust transport are assessed. For all c
omparisons with measurements, agreement was found to be within 30%, No
commercial CFD program appeared to be clearly superior for all applic
ations, but FLOTHERM had the most use for realistic cooling design pro
blems.