P. Hui et Hs. Tan, ON THE EFFECT OF NONLINEAR BOUNDARY-CONDITIONS FOR HEAT-CONDUCTION INDIAMOND HEAT SPREADERS WITH TEMPERATURE-DEPENDENT THERMAL-CONDUCTIVITY, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(4), 1997, pp. 537-540
For steady-state heat conduction in diamond heat spreaders with temper
ature-dependent thermal conductivity, we examine the valid range of th
e commonly used approximate solution against a rigorous solution which
we have recently formulated, The basic difference between our work an
d the approximate solution lies in the boundary condition (bc) of the
transformed temperature over the spreader-sink interface-we use a nonl
inear be whereas the be in the approximate solution has been assumed t
o be linear, We point out that the valid range of the approximate solu
tion is determined by the temperature difference above the ambient ove
r the interface, The discrepancy between the two solutions becomes sev
ere (>10%) for devices of radius around 50 mu m involving high power d
issipation (>20 W).