P. Chabert et al., INVESTIGATION OF A SF6 HELICON PLASMA, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 16(1), 1998, pp. 78-86
Citations number
26
Categorie Soggetti
Physics, Applied","Materials Science, Coatings & Films
We present a study of a helicon plasma with SF6 gas, operating at 13.5
6 MHz and powers between 0 and 2000 W, pressure between 0.3 and 7.5 mT
orr, and flow rates between 4 and 40 sccm. All the measurements of pla
sma and gas parameters were made in the downstream diffusion chamber,
below the helicon source. Two main regimes have been observed: at low
power (typically <200 W), the plasma is not luminous in the source and
ionization takes place in the diffusion chamber where there is an ele
ctric field. At high power, the plasma is strongly dissociated and the
ionization occurs in the source for pressure above 0.9 mTorr and in t
he diffusion chamber when the pressure is below. The fluorine atom con
centration increases with power until a saturation level [F](sat) is r
eached. The gas flow rate determines the power required to reach the s
aturation whereas [F](sat) is proportional to the pressure. The power
required for the dissociation can be an important part of the power in
jected into the reactor leaving less power for ionization. This leads
to a decrease of the plasma density when the flow rate increases at co
nstant pressure. (C) 1998 American Vacuum Society.