COMBINING TRANSMISSION ELECTRON-MICROSCOPY WITH FOCUSED ION-BEAM SPUTTERING FOR MICROSTRUCTURAL INVESTIGATIONS OF ALGAAS GAAS HETEROJUNCTION BIPOLAR-TRANSISTORS/
Cw. Snyder et al., COMBINING TRANSMISSION ELECTRON-MICROSCOPY WITH FOCUSED ION-BEAM SPUTTERING FOR MICROSTRUCTURAL INVESTIGATIONS OF ALGAAS GAAS HETEROJUNCTION BIPOLAR-TRANSISTORS/, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 13(4), 1995, pp. 1514-1518
Transmission electron microscopy (TEM) and focused ion beam sputtering
have been used for investigations of microstructure and defect format
ion in AlGaAs/GaAs heterojunction bipolar transistors. The use of focu
sed ion beam sputtering to prepare nearly ideal thin membranes within
the active region of transistors for cross-sectional electron microsco
py is described. Results are obtained from as-fabricated devices, devi
ces annealed at temperatures of 400 degrees C, and devices for which '
'aging'' is accelerated by operating at high-bias conditions and heati
ng in combination. We find that electrical operation leads to signific
ant microstructural changes which are distinct from those observed in
devices which are annealed. TEM images of the metal/semiconductor cont
act reveal ''metal spiking'' and facetted structures associated with a
lloy interpenetration. Characterization of the semiconductor heterojun
ctions reveal precipitates at the emitter-base junction. Mechanisms fo
r the formation of these defects under high-biased operation are discu
ssed. (C) 1995 American Vacuum Society.