METAL-OXIDE-SEMICONDUCT OR FIELD-EFFECT TRANSISTOR JUNCTION REQUIREMENTS

Authors
Citation
M. Duane et W. Lynch, METAL-OXIDE-SEMICONDUCT OR FIELD-EFFECT TRANSISTOR JUNCTION REQUIREMENTS, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 16(1), 1998, pp. 306-311
Citations number
11
Categorie Soggetti
Physics, Applied","Engineering, Eletrical & Electronic
ISSN journal
10711023
Volume
16
Issue
1
Year of publication
1998
Pages
306 - 311
Database
ISI
SICI code
1071-1023(1998)16:1<306:MOFTJR>2.0.ZU;2-#
Abstract
The detailed requirements far shallow junctions for deep sub-micron me tal-oxide-semiconductor field-effect transistors are reviewed and expl ained. The National Technology Roadmap for Semiconductors Lists the co ncentration and depth requirements for the next several generations of technology, but does not provide detailed explanation of the electric al requirements that drive these physical junction characteristics. Th ere are actually many more constraints on junction formation in an int egrated complimentary metal-oxide-semiconductor flow, e.g., the effect of the junction formation on the channel region, which can include po ly depletion. boron penetration, and reverse short channel effects. Th e guidelines presented here should be useful to researchers developing ultrashallow junction processes or measurement techniques. (C) 1998 A merican Vacuum Society.