CONSIDERATION OF IN-LINE QUALIFICATION FOR ULTRASHALLOW JUNCTION IMPLANTATION

Citation
W. Boyd et al., CONSIDERATION OF IN-LINE QUALIFICATION FOR ULTRASHALLOW JUNCTION IMPLANTATION, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 16(1), 1998, pp. 447-452
Citations number
8
Categorie Soggetti
Physics, Applied","Engineering, Eletrical & Electronic
ISSN journal
10711023
Volume
16
Issue
1
Year of publication
1998
Pages
447 - 452
Database
ISI
SICI code
1071-1023(1998)16:1<447:COIQFU>2.0.ZU;2-X
Abstract
The electrical characteristics of shallow junction devices are often d ependent on tightly controlled ion implants for their performance and yield. However, concerns exist over the ability of existing in-line me trology tools to accurately verify low energy implants, and therefore, determine whether the ion implanter is in control before committing p roduct to it. This article will explore the capabilities of the Therma -Probe TP500, the Tencor OmniMap RS75, and secondary-ion-mass spectros copy to measure low energy ion implants done on an Applied Materials x R-LEAP with energies 10 keV and below, doses of 1.0E15-3.0E15 cm(-2), and both boron and arsenic species. (C) 1998 American Vacuum Society.