W. Boyd et al., CONSIDERATION OF IN-LINE QUALIFICATION FOR ULTRASHALLOW JUNCTION IMPLANTATION, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 16(1), 1998, pp. 447-452
The electrical characteristics of shallow junction devices are often d
ependent on tightly controlled ion implants for their performance and
yield. However, concerns exist over the ability of existing in-line me
trology tools to accurately verify low energy implants, and therefore,
determine whether the ion implanter is in control before committing p
roduct to it. This article will explore the capabilities of the Therma
-Probe TP500, the Tencor OmniMap RS75, and secondary-ion-mass spectros
copy to measure low energy ion implants done on an Applied Materials x
R-LEAP with energies 10 keV and below, doses of 1.0E15-3.0E15 cm(-2),
and both boron and arsenic species. (C) 1998 American Vacuum Society.