0.15-MU-M BURIED-CHANNEL P-MOSFETS WITH ULTRATHIN BORON-DOPED EPITAXIAL SI LAYER
Citation
T. Ohguro et al., 0.15-MU-M BURIED-CHANNEL P-MOSFETS WITH ULTRATHIN BORON-DOPED EPITAXIAL SI LAYER, I.E.E.E. transactions on electron devices, 45(3), 1998, pp. 717-721
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied
SICI code
0018-9383(1998)45:3<717:0BPWUB>2.0.ZU;2-1
Abstract
We demonstrated silicon MOSFET's with a counter-doped ultrathin epitax
ial channel grown by low-temperature UHV-CVD; this allows the channel
region to be doped with boron with high precision. The boron concentra
tion and epitaxial layer thickness can be chosen independently, and so
it is easy to adjust the threshold voltage of the buried-channel p-MO
SFET's with n-type polysilicon gates. It was confirmed that choosing a
n ultrathin epitaxial layer at 10 nm leads to suppression of the short
-channel effects in buried-channel p-MOSFET's with gate length down to
0.15 mu m, while maintaining an appropriate value of threshold voltag
e.