M. Saito et al., 0.15-MU-M RF CMOS TECHNOLOGY COMPATIBLE WITH LOGIC CMOS FOR LOW-VOLTAGE OPERATION, I.E.E.E. transactions on electron devices, 45(3), 1998, pp. 737-742
Radio Frequency (RF) CMOS is expected to replace bipolar and GaAs MESF
ET's in RF front-end IC's for mobile telecommunications devices in the
near future, In order for the RF CMOS to be popularly used in this ap
plication, compatibility of its process for high-speed logic CMOS and
low supply voltage operation are important for low fabrication cost an
d low power consumption, In this paper, a 0.15-mu m RF CMOS technology
compatible with logic CMOS for low-voltage operation is described, Be
cause the fabrication process is the same as the high-speed logic CMOS
, manufacturibility of this technology is excellent, Some of the passi
ve elements can be integrated without changing the process and others
can be integrated with the addition of a few optional processes, Mixed
RF and logic CMOS devices in a one-chip LSI can be realized with rela
tively low cost, Excellent high-frequency characteristics of small geo
metry silicon MOSFET's with low-power supply voltage are demonstrated,
Cutoff frequency of 42 GHz of n-MOSFET's, which is almost the same le
vel at that of general high-performance silicon bipolar transistors, w
as obtained, N-MOSFET's maintained enough high cutoff frequency of 32
GHZ even at extremely low supply voltage of 0.5 V. Moreover, it was co
nfirmed that degradation of minimum noise figure for deep submicron MO
SFET's with 0.5 V operation is sufficiently small compared with 2.0 V
operation, These excellent high-frequency characteristics of small geo
metry silicon MOSFET's under low-voltage operation are suitable for mo
bile telecommunications applications.