The aim of this article is to give a thorough analysis of the hot carr
ier effects in bulk Si MOSFETs. The gate I-g and substrate I-b current
s are investigated in a wide range of applied biases (gate, drain and
substrate), gate length (from 0.8 down to 0.1 mu m) and temperature (d
own to near liquid helium). Substantial differences between the variat
ions of I-b and I-g with temperature and applied biases are highlighte
d. These observations show that the physical mechanisms responsible fo
r these two currents are substantially different in a wide channel len
gth range. The substrate current is created by low energy carriers hea
ted by the pinch-off electric field, whereas the gate current is induc
ed by high energy carriers caused by the secondary heating at the drai
n-substrate junction. (C) 1998 Elsevier Science Ltd.