X-RAY MASKS FOR VERY DEEP X-RAY-LITHOGRAPHY

The high aspect ratio, deep x-ray lithography and electrodeposition pr ocess [Becker et al. (1986)] can be expensive unless throughput is hig h enough. The use of a very high energy synchrotron has allowed the co st of exposure to be significantly reduced through simultaneous exposu re of stacked photoresist [Guckel et al (1994)]. Synchrotron radiation at high photon energies has resulted the use of a large area x-ray ma sk, Both stacked exposures and a large area x-ray masks have significa ntly increased the throughput of the deep x-ray lithography and electr odeposition process.