HIGH-PERFORMANCE THIN-FILM TRANSISTORS FABRICATED USING EXCIMER-LASERPROCESSING AND GRAIN ENGINEERING

Citation
Gk. Giust et Tw. Sigmon, HIGH-PERFORMANCE THIN-FILM TRANSISTORS FABRICATED USING EXCIMER-LASERPROCESSING AND GRAIN ENGINEERING, I.E.E.E. transactions on electron devices, 45(4), 1998, pp. 925-932
Citations number
22
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied
ISSN journal
00189383
Volume
45
Issue
4
Year of publication
1998
Pages
925 - 932
Database
ISI
SICI code
0018-9383(1998)45:4<925:HTTFUE>2.0.ZU;2-1
Abstract
High-performance polysilicon thin-film transistors (TFT's) are fabrica ted using an excimer laser to recrystallize the undoped channel and do pe the source-drain regions, Using a technique we call ''grain enginee ring'' we are able to control grain microstructure using laser paramet ers, Resulting polysilicon films are obtained with average grain sizes of similar to 4-9 mu m in sub-100 nm thick polysilicon films without substrate heating during the laser recrystallization process; Using a simple four-mask self-aligned aluminum top-gate structure, we fabricat e TFT's in these films, By combining the grain-engineered channel poly silicon regions with laser-doped source-drain regions, TFT's are fabri cated with electron mobilities up to 260 cm(2)/Vs and on/off current r atios greater than 10(7). To our knowledge, these devices represent th e highest performance laser-processed TFT's reported to date fabricate d without substrate heating or hydrogenation.