STRESS-INDUCED DEGRADATION FEATURES OF VERY THIN GATE OXIDES

Citation
A. Scarpa et al., STRESS-INDUCED DEGRADATION FEATURES OF VERY THIN GATE OXIDES, Microelectronics and reliability, 38(2), 1998, pp. 195-199
Citations number
7
Categorie Soggetti
Engineering, Eletrical & Electronic
ISSN journal
00262714
Volume
38
Issue
2
Year of publication
1998
Pages
195 - 199
Database
ISI
SICI code
0026-2714(1998)38:2<195:SDFOVT>2.0.ZU;2-A
Abstract
The degradation features of very thin gate oxide after Fowler-Nordheim stress have been studied. Bulk oxide, cathodic and anodic regions hav e been analysed from the charge build-up point of view, as well as the stress induced generation of Si/SiO2 fast interface state density. A physical interpretation of experimental results has been proposed, inv olving two types of stress induced positive charge building up at inte rface regions. It is shown that a critical oxide thickness exists, und er which the degradation mechanisms could be considerably different. ( C) 1998 Elsevier Science Ltd.